In this dynamic role, you will collaborate with lead design engineers on board-level circuit design, integration, verification, and documentation of state-of-the-art aerospace processors and FPGA assemblies.This position combines some leadership with hands-on technical work, requiring you to contribute at every stage of the design cycle.
**Roles and Responsibilities**- Design complex avionics systems, integrating both digital and analog components.
- Stay aware of technology trends and advancements in embedded systems and electronic components.
- Design processor and FPGA assemblies, including schematic capture, component placement, layout constraints, PWB stack-up, and layout review/approval.
- Conduct board bring-up, integration, and verification activities to ensure robust performance.
- Troubleshoot mid-high complex issues involving processors, FPGAs, and memory components.
- Participate in architectural trade studies and proposal development to drive strategic decisions.
- Interface with customers independently, providing expert guidance and support.
- Mentor junior engineers, fostering their growth and development.
- Lead and coordinate multi-disciplinary design teams, ensuring cohesive and effective collaboration.
- Propose and implement improvements in internal processes to drive efficiency and innovation.
**Required Qualifications**- Bachelor's degree in Electrical Engineering or related field.
- Proven experience in board-level digital design, including schematic design, implementation, integration, and verification.
- Expertise in designing high-speed interfaces.
- Understanding in Board Level Timing Analysis, Stress and Derate Analysis, Signal Integrity & Power Integrity.
- Great technical writing and communication skills.
- Experience mentoring and sharing expertise with junior engineers.




**Desired Characteristics**- Master's degree in Electrical Engineering with 6+ years of professional experience in digital design.
- Proven track record of designing complex digital hardware systems.
- In-depth knowledge of the board-level digital design process, from schematic capture to implementation, integration, and verification.
- Expertise in laying out complex Printed Wiring Boards (PWBs).
- Experience designing with high-speed components such as Gigahertz microprocessors, FPGA, CPLD, DDR3 or DDR4 memory, flash memory, Gigabit Ethernet, and PCIe.
- Proficiency in working with large pin count devices, featuring ****+ pins with 0.8mm device pitch or smaller.
- Skilled in High Density Interconnect (HDI) technologies, including micro vias, buried/blind vias, and back drilling for IPC Class 3 boards.
- Experience in designing high-speed serial links of 5+ Gbps, such as 10GBASE-KR, PCIe Gen3, and Fiber Optics.
- Familiarity with communication protocols like CAN, MIL-STD-****, ARINC 429, ARINC 664, and TSN.
- Knowledge of OpenVPX and PICMG standards.
- Extensive experience in the Military, Aerospace, or Avionics sectors.
- Proficient with Mentor Graphics Expedition Enterprise and HyperLynx PI/SI tools.
- Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio.
- Strong technical writing and communication skills.Note:**To comply with US immigration and other legal requirements, it is necessary to specify the minimum number of years' experience required for any role based within the USA.
** **For roles outside of the USA, to ensure compliance with applicable legislation, the JDs should focus on the substantive level of experience required for the role and a minimum number of years should NOT be used.
****Additional Information**:**Relocation Assistance Provided**:No

📌 Lead Digital Circuit Designer (Santiago de Querétaro)
🏢 GE Aerospace
📍 Santiago de Querétaro