Remote package design engineer for ai hpcs (México)

Remote package design engineer for ai hpcs (México)

19 oct
|
SPD Technology
|
México

19 oct

SPD Technology

México

spd-technology seeks a seasoned package design engineer to push the boundaries of semiconductor packaging. You will develop substrates for 2.5d/3.5d packaging, collaborating with si/pi, thermal, mechanical, and pcb teams to ensure high performance and reliability across data center scale systems.

the role emphasizes end-to-end design, from routing feasibility studies to manufacturing documentation, with a focus on ppa optimization and tco reduction.

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📌 Remote package design engineer for ai hpcs (México)
🏢 SPD Technology
📍 México

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