Remote Package Design Engineer for AI HPCs (Ejido de la Finca)

Remote Package Design Engineer for AI HPCs (Ejido de la Finca)

19 oct
|
SPD Technology
|
Ejido de la Finca

19 oct

SPD Technology

Ejido de la Finca

Spd-Technology seeks a seasoned Package Design Engineer to push the boundaries of semiconductor packaging. You will develop substrates for 2.5D/3.5D packaging, collaborating with SI/PI, thermal, mechanical, and PCB teams to ensure high performance and reliability across data center scale systems.
The role emphasizes end-to-end design, from routing feasibility studies to manufacturing documentation, with a focus on PPA optimization and TCO reduction.

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📌 Remote Package Design Engineer for AI HPCs (Ejido de la Finca)
🏢 SPD Technology
📍 Ejido de la Finca

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