Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron

Technology's vision is to transform how the world uses information to enrich life for all and our dedication to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a general leader in memory and storage solutions. This means conducting business with integrity, accountability, and patience while supporting our global community. Major product technologies developed at Micron include DRAM, LPDRAM, Graphics DRAM, NAND, HBM, HMC, 3DXP, Managed NAND and SSDs within the consumer, server, mobile, networking, graphics, automobile and embedded businesses.

The SI R&D; works on analysis of end to end systems solutions including but not limited to circuit level, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron's memory solutions. The team owns all steps of the signal and power integrity analysis process including die, package and system model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support. Leading the design and analysis of high speed (HS) memory interfaces and power distribution networks (PDN). definition, electrical modeling, simulation analysis and optimization for given current workloads.

Leading out in SI/PI development across a broad range of Micron's portfolio to ensure product electrical performance through modeling, simulation, analysis, and correlation to measurement for the various products.



Representing the SI R&D; team in technical cross-functional collaborative groups, and integrating with package design, silicon design, system design, product engineering, and marketing departments to ensure overall product performance. Driving and development of SI/PI aspects of future standards (including but not limited to JEDEC, ONFI, and IBIS) through system and product electrical capability exploration.

Supporting external customer as needed Developing methodologies and processes for SI/PI analysis Supporting (and in some cases driving) path-finding activities for IO and channel innovation to enable next generation of memory technologies at higher speeds and densities Qualifications PhD or MSEE and with at least 10 years of industry experience Deep experience in Signal and Power Integrity Background, particularly in areas that affect I/O circuit signaling performance, PMICs, current workloads, PI performance & optimization and Experience with equalization schemes for IO circuits Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience Experience with, and working knowledge of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, POWERSI, CLARITY, HSPICE, ADS, etc. Deep understanding of electromagnetic and transmission line theory, general I/O design, signal integrity,



differential and single-ended interface technologies Deep understanding of timing budgets and jitter analysis Expertise in Printed Circuit Board (PCB) layout or electrical package design techniques Experience in design and analysis of high-speed single-ended or differential buses Familiarity with, and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc. Familiarity with peak distortion analysis, statistical analysis (DOE) and equivalent tools (example: JMP) is also beneficial Memory industry experience is desired Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, and have the ability to work well in a team with varied strengths Understanding of AI/ML is desired Successful candidates for this position will be: Pro-active – Candidate will be expected to identify gaps and opportunities and address them with minimal supervision.

With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

📌 Manufacturing Engineering Team Leader (Aguascalientes)
🏢 Micron Technology
📍 Aguascalientes