1. Knowledge of Electronic Circuits and Semiconductor Components
Proficient in the operating principles and common failure modes of active and passive components such as ICs, resistors, capacitors, diodes, and MOSFETs. Capable of reading schematics and PCB layout designs, understanding signal flow, and analyzing key power delivery structures.
2. Measurement and Diagnostic Equipment Operation
Skilled in using diagnostic and analysis equipment, including:
- Oscilloscope
- Logic Analyzer
- Power Supply and Digital Multimeter (e.g., Fluke 179)
- Thermal Imaging Camera, X-ray, 3D AOI
- ICT Test System
- Curve Tracer and Thermal Stream environment
3. Failure Mode Analysis and Reporting
Able to identify and interpret various failure modes, including: Short, Open, Shifted/Broken/Missing components, Burn Marks, Overheating, BGA solder defects, etc. Capable of writing clear FA (Failure Analysis)



reports, covering root cause analysis, experimental data, and corrective action recommendations.
4. Soldering and Micro-rework Skills
Proficient in hand-soldering and de-soldering techniques. Familiar with high-density component rework processes such as BGA, QFN, and SMD packages.
5. Cross-Functional Communication and Problem-Solving Ability
Able to collaborate with R&D;, Manufacturing, Repair, and Quality Assurance teams to jointly troubleshoot failures and propose technical solutions.
Tipo de puesto: Jornada completa
Sueldo: $1.00 - $2.00 al mes
Pregunta(s) de postulación:
- Favor de mencionar su ultimo o actual salario mensual.
Lugar de trabajo: Empleo presencial

📌 Failure Analysis Engineer (Urbivilla del Prado)
🏢 Inventec IEC Technologies
📍 Urbivilla del Prado