1. Knowledge of Electronic Circuits and Semiconductor Components

Proficient in the operating principles and common failure modes of active and passive components such as ICs, resistors, capacitors, diodes, and MOSFETs. Capable of reading schematics and PCB layout designs, understanding signal flow, and analyzing key power delivery structures.

2. Measurement and Diagnostic Equipment Operation

Skilled in using diagnostic and analysis equipment, including:
- Oscilloscope
- Logic Analyzer
- Power Supply and Digital Multimeter (e.g., Fluke 179)
- Thermal Imaging Camera, X-ray, 3D AOI
- ICT Test System
- Curve Tracer and Thermal Stream environment

3. Failure Mode Analysis and Reporting

Able to identify and interpret various failure modes, including: Short, Open, Shifted/Broken/Missing components, Burn Marks, Overheating, BGA solder defects, etc. Capable of writing clear FA (Failure Analysis)



reports, covering root cause analysis, experimental data, and corrective action recommendations.

4. Soldering and Micro-rework Skills

Proficient in hand-soldering and de-soldering techniques. Familiar with high-density component rework processes such as BGA, QFN, and SMD packages.

5. Cross-Functional Communication and Problem-Solving Ability

Able to collaborate with R&D;, Manufacturing, Repair, and Quality Assurance teams to jointly troubleshoot failures and propose technical solutions.

Tipo de puesto: Tiempo completo

Sueldo: $1.00 - $2.00 al mes

Pregunta(s) de postulación:
- Favor de mencionar su ultimo o vigente salario mensual.

Lugar de trabajo: Empleo presencial

📌 Failure Analysis Engineer (Urbivilla del Prado)
🏢 Inventec IEC Technologies
📍 Urbivilla del Prado