Responsibilities

- Lead the Development of Advanced PCBA / SI Mfg capabilities in the Mexico sites

- Collaborate and interact with customer technical team and Foxconn R&D; to co-develop Test

Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework technology, component packaging and / or process material. Fostering strong and collaborative relationships with clients and internal cross functional teams.

- Lead the Mfg technical team and work the labs at Mexico and global labs to perform all the process

and reliability evaluation regularly. .

- Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg

Capabilities .

- Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical

professionals.

Requirements

- Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.





- Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for

PCBA and SI and minimum 5 years in management position.

- At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)

environment with a proven record.

- Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged

Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are preferable,

- Strong English communication skills (listening, speaking, reading, and writing) and excellent

interpersonal skill

- Ability to lead projects from beginning to end and drive initiatives with a general team.

- Ability to work under pressure.

- Work location is in Mexico.

📌 Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico
🏢 Foxconn Industrial Internet - FII
📍 Guadalajara