Responsibilities

- Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites.
- Collaborate and interact with customer technical team and Foxconn R&D; to co‑develop tests, vehicle technical specifications, checklists, reliability testing, DFM, and processes for new assembly and rework technology, component packaging and/or process material.
- Foster strong and collaborative relationships with clients and internal cross‑functional teams.
- Lead the Mfg technical team and work in the labs at Vietnam and general labs to perform all process and reliability evaluations regularly.
- Support Foxconn central and other sites and business units to share and develop new Advanced Mfg capabilities.
- Develop and mentor leaders to possess good people skills and to be well‑rounded, high‑potential technical professionals.

Requirements

- Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.




- Minimum of 10 years of Mfg Engineering and Process/Technology Development experience for PCBA and SI, with at least 5 years in a management position.
- At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM) environment, with a proven record.
- Knowledge and experience of PCBA with large‑size BGA (> 80 mm x 80 mm), co‑packaged optics, thermal compression bonding, high‑speed connectors/flying cable, and liquid cooling are preferable.
- Strong English communication skills (listening, speaking, reading, and writing) and excellent interpersonal skills.
- Ability to lead projects from beginning to end and drive initiatives with a global team.
- Ability to work under pressure.
- Work location is in Mexico.

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📌 Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico (Centro)
🏢 Foxconn Industrial Internet - FII
📍 Centro