**Job Description**:
Additional responsibilities:
- IC top level floor planning including hard macro block placement, padring, RDL and bump pattern/assignment
- System level co-design methodology of IC, Package and PCB/Boar
- Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
- Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
- Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels
- Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
Minimum Qualifications:
- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
- 2+ years Hardware Engineering experience or related work experience.




- Preferred Qualifications:
- Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis
- Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory
- Experience in IC package, SIP module and/or PCB selection, design and layout.
- Experience in Pinmap optimization of optimal package, SIP module and/or PCB designs
- Experience in IC, package, PCB co-design for system performance optimization.
- Hands on experience with Cadence SIP and/or Mentor Xpedition.
- Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
- Familiar with assembly and substrate manufacturing process is a plus
Education Requirements
Bachelor's Electrical Engineering and/or Mechanical Engineering.
Preferred: Master's, Electrical Engineering.

📌 Package Design Engineer (Tijuana)
🏢 North American Production Sharing
📍 Tijuana