Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico

Responsibilities

- Lead the development of advanced PCBA / SI Mfg capabilities in the Mexico sites
- Collaborate and interact with customer technical team and Foxconn R&D; to co-develop test vehicle, technical spec/checklist, reliability testing, DFM and process for new assembly, rework technology, component packaging and/or process material. Foster strong and collaborative relationships with clients and internal cross-functional teams
- Lead the Mfg technical team and work the labs at Mexico and global labs to perform all the process and reliability evaluation regularly
- Support Foxconn central and other sites and BUs to share and develop new advanced Mfg capabilities
- Develop and mentor leaders to have good people skills and as well-rounded, high-potential technical professionals

Requirements

- Bachelor's or Master's degree in Engineering, Material Science, Statistics,



or related fields
- Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for PCBA and SI and minimum 5 years in management position
- At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM) environment with a proven record
- Knowledge and experience of PCBA with large size BGA (> 80 mm × 80 mm), Co-Packaged Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are preferable
- Strong English communication skills (listening, speaking, reading, and writing) and excellent interpersonal skill
- Ability to lead projects from beginning to end and drive initiatives with a general team
- Ability to work under pressure
- Work location is in Mexico

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📌 Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico
🏢 Foxconn Industrial Internet
📍 Guadalajara