**Company**:QUALCOMM SEMICONDUCTORES Y SISTEMAS AVANZADOS DE BAJA CALIFORNIA
**Job Area**:Engineering Group, Engineering Group > Failure Analysis Engineering
**General Summary**:
**Minimum Qualifications**:
- Bachelor's degree in Science, Engineering, or related field.
**Primary Responsibilities**
- Performs failure analyses on complicated issues requiring creative problem solving. Acts as the case owner for multiple issues and devices in parallel.
- Applies advanced knowledge in an area of failure analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing, etc.) to solve problems, and seeks resources from other teams to find alternatives
- Administers non-destructive testing on devices using imaging tools (e.g., X-ray, C-SAM) and/or optical inspections.
- Hands-on electrical fault isolation analysis by use of static laser techniques XIVA, OBIRCh and Photo Emission Microscopy, Lock-In Thermal microscopy to localize areas of interest and isolate location of defect.
- Hand-on advance electrical fault isolation techniques, Dynamic Laser stimulation, thermal and photonic fault injection while interfacing with system level, automated test equipment and bench testing platforms for functional debug.
- Performs physical failure analysis on module, package and individual IC to identify evidence of defects on high-risk, isolated issues in which analysis can only be performed once on a single device.
- Documents results of failure analysis, reports identified root cause and delivers conclusions to requesters.
**Skills Requirements**
- Fast for learning and able to perform independent work.
- Strong knowledge of semiconductor physics, semiconductor devices, circuitry analysis and wafer fabrication process.




- Proficient in various physical and electrical analysis techniques such as mechanical polishing, Chemical delayering, SEM inspection, curve trace, thermal emission, photon emission, OBIRCH/TIVA.
- Proficient in tester interface optical fault isolation including Soft Defect Localization, Laser Voltage Probing. Frequency mapping, time resolved emission and thermal mapping,
- Experience in SEM based nano-probing with EBIC, EBAC and EBIRCH on planar, SOI and Finfet technologies.
- Familiar with SCAN logic, Memory BIST and RF/Analog design strategies.
- Familiar with Reliability testing for Device and packaging product qualification including CDM, HBM, TLP, HTOL, BHAST, BURN-IN etc.
- FA experience in semiconductor industry preferred.
- Must be a good communicator, have good organization and project management skills, be able to work in a laboratory environment, and be effective getting results by working with multi-functional teams.
- Versátil working time and able to work on weekend shift or mid-night shift.
- Experience in programming languages such as python, scripting, Power BI etc.
**Preferred Qualifications**
**Education**:
Masters Electrical Engineering, Microelectronics, Physics related
Work Experiences:
2+ years chip-level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience.
**Skills**:Automated Test Equipment (ATE), Data Analysis, Failure Analysis, Product Development, Product Reliability
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
If you would like more information about this role, please contact Qualcomm Careers.

📌 Failure Analysis Engineer (Tijuana)
🏢 Qualcomm
📍 Tijuana